Eventos Anais de eventos
COBEM 2023
27th International Congress of Mechanical Engineering
NUMERICAL MODELING OF A ELECTROPLATED DIAMOND WIRE FOR CRYSTALLINE SILICON MACHINING
Submission Author:
Erick Cardoso Costa , SC
Co-Authors:
Pedro Córdula de Sousa, Erick Cardoso Costa, Fabio Antonio Xavier
Presenter: Pedro Córdula de Sousa
doi://10.26678/ABCM.COBEM2023.COB2023-1780
Abstract
The continuous and growing demand for the use of renewable sources for energy generation has resulted in an increase in studies and research on the manufacturing process of solar panels, both in optimizing their energy efficiency and in production control to reduce manufacturing costs. The costs related to the cutting process represent about 50% of the total manufacturing cost, while raw materials contribute around 40% of the total cost. In this sense, research on crystalline silicon machining processes is fundamental to obtain a component with higher quality and optimized process parameters, allowing the reduction of the costs. Thus, the application of computational modeling of the machining process can assist in decision-making regarding process parameters without a long and costly experimental stage, thereby reducing production time. This paper proposes the modeling of the cutting tool used in the processing of crystalline silicon in Python code: the electroplated diamond wire. In order to obtain a model that is faithful to the real tool, the main properties of the diamond wire were implemented into the model: abrasive density, abrasive size, abrasive rake angle, wire core diameter, and outer diameter. Two types of industrial diamond wires were generated in order to evaluate the accuracy of the proposed model. For the first industrial tool, the use of polar coordinates and conical abrasives with a log-normal distribution of rake angle (φ) between 55-75˚ and a grain size varying between 30-45µm were attached on a wire and bonding layer, limiting them to an outer diameter of 350 µm. The distribution of the abrasives on the wire mesh was performed using the Monte-Carlo statistical method to obtain an abrasive density of 60 abrasives/mm², and the inner diameter was defined at 250 µm. As for the second type of diamond wire, the abrasive grain size was according to norm D76, outer diameter of 450 µm, abrasive density of 210 abrasives/mm² and distribution of rake angle stablished at 55-75˚. The results show that all of the aforementioned characteristics converge to a modulus average that coincides with the characteristics indicated by the industrial suppliers of the diamond wires, which allows the use of the model for machining simulations according to the desired cutting tool type. Thus, the influence of these characteristics can be studied in order to quantify their effects on the machined surface quality of the crystalline silicon, and thus to optimize them to obtain minimum surface roughness and subsurface damage which result in greater efficiency of the final product.
Keywords
sawing process, brittle material machining, cutting tool modeling, photovoltaic industry
