Eventos Anais de eventos
COBEM 2023
27th International Congress of Mechanical Engineering
Development of a Heat Transfer Correlation for Thermal Simulation of Finned Heat Sinks in Electronics Under Forced Convection
Submission Author:
Aron Martins Ferreira Milagres , MG
Co-Authors:
Gustavo Paul Exel, Aron Martins Ferreira Milagres, Vitor de Melo Braga, Rafaela Garcia, Cesar Deschamps
Presenter: Aron Martins Ferreira Milagres
doi://10.26678/ABCM.COBEM2023.COB2023-0852
Abstract
With the increasing power density of electronics, accurate thermal simulations have become essential for effective thermal management and heat dissipation in the design of electronic systems. There are various techniques for thermal management of electronic components, including heat sinks, fans, and liquid cooling systems. Heat sinks are passive cooling devices that absorb and dissipate heat generated by the component. They increase the surface area of the component, allowing more efficient heat transfer to the surrounding air. While Computational Fluid Dynamics (CFD) are widely used for thermal analysis in engineering applications, its use in design optimization routines is limited by its high computational cost. Therefore, lumped-parameter models are often used as an alternative for thermal analysis, especially in the early design stages. However, these models require the specification of heat transfer coefficients as boundary conditions. This study reports the development of a correlation for the thermal simulation of finned heat sinks of electronics under forced convection. The CFD model used in this development was validated by comparing predictions of convection heat transfer coefficient with experimental correlations available in the literature. The proposed correlation was developed for wider ranges of air velocities and heat sink dimensions than those available in the literature. The correlation was implemented in a lumped-parameter model to predict the temperature of an electronic component, which was found to be in good agreement with the results of a full CFD model. By accurately predicting the temperature distribution on printed circuit boards (PCBs) using advanced lumped models, hardware engineers can optimize their designs for more efficient heat dissipation, resulting in significant improvements in both performance and reliability. This is particularly crucial in high-performance systems, where heat dissipation can often be a limiting factor in achieving optimal performance.
Keywords
Thermal management, Printed Circuit Board, Heat transfer correlation, CFD
