Eventos Anais de eventos
COBEM 2023
27th International Congress of Mechanical Engineering
INVESTIGATION OF A THIN LOOP HEAT PIPE WITH A NOVEL POROUS MEDIA
Submission Author:
Kelvin Guessi Domiciano , SC
Co-Authors:
Kelvin Guessi Domiciano, Larissa Krambeck, Marcia Mantelli
Presenter: Kelvin Guessi Domiciano
doi://10.26678/ABCM.COBEM2023.COB2023-0257
Abstract
Loop heat pipes (LHPs) are promising two-phase heat transfer technologies used in many applications, among them, the thermal control of electronics. To enhance their thermal performance, the wick structure must be carefully designed. In the present work, a flat thin loop heat pipe, specially designed for the thermal management of electronic gadgets, with a new wick structure, was thermally investigated. This novel porous media consisted of twisting several copper threads of a commercial electrical cable. To investigate the efficiency of the novel proposed wick structure, a loop thermosyphon, with the same external geometry but with no porous media inside, was developed for comparison of their thermal performances. The external dimensions of both devices were 76 x 60 mm² and 1.1 mm in thickness. Diffusion bonding was used as the major fabrication process. Both devices are tested in the gravity-assisted orientation for several heat fluxes. In conclusion, the novel wick structure of twisting several threads of copper wires, which is low cost and simple to fabricate, operated efficiently as a capillary structure for mini LHPs, improving their thermal performance and making it a suitable cooling alternative for flat electronic gadgets.
Keywords
Loop heat pipe, Diffusion bonding, Thermal performance, electronics application, novel wick structure
