Papers  List :      Electronic Packaging

PARTICLE IMAGE VELOCIMETRY MEASUREMENTS AT THE ENTRANCE REGION OF A ONE-SIDED HEATED VERTICAL CHANNEL IN NATURAL CONVECTION

NUMERICAL AND EXPERIMENTAL ANALYSIS OF THE NATURAL CONVECTION IN CAVITIES WITH PROTRUDING HEAT SOURCES AT THE BASE

NATURAL CONVECTION IN A VERTICAL CAVITY WITH HEAT SOURCES SIMULATING ELECTRONIC COMPONENTS

STUDY OF THE ASPECT RATIO EFFECT IN A THERMALLY-DRIVEN OPEN CAVITY

THE INFLUENCE OF THE DISTANCE BETWEEN PLATES IN AN ARRAY OF VERTICAL PRINTED CIRCUIT BOARDS COOLED BY NATURAL CONVECTION: NUMERICAL AND EXPERIMENTAL ANALYSIS

PRESSURE DROP AND HEAT TRANSFER IN AIRFLOW COOLED FINNED HEAT SINKS USING CORRELATIONS

SMT: MATERIALS, FABRICATION PROCESSES AND FATIGUE STRENGTH OF SOLDERS

TRIDIMENSIONAL ANALYSIS OF TELECOMMUNICATION CABINETS: THERMAL SIMULATION

3D MODEL TO ANALYSE THE THERMAL BEHAVIOR OF A DIGITAL RECTIFIER

UTILIZATION OF THERMOELECTRIC DEVICES FOR COOLING ELECTRONIC EQUIPMENT INSTALLED IN CABINETS