| |
|
S7 Empacotamento Eletrônico |
| |
|
Title:
|
UTILIZATION OF THERMOELECTRIC DEVICES FOR COOLING ELECTRONIC EQUIPMENT INSTALLED IN CABINETS
|
| |
|
Summary :
|
|
ABSTRACT. THE PROCEDURE EMPLOYED IN THE DESIGN OF A THERMAL CHAMBER TO BE CONSTRUCTED USING THERMOELECTRIC COOLERS IS DESCRIBED IN DETAIL. THE CHAMBER WAS DESIGNED IN ORDER TO CREATE A SUITABLE MICROCLIMATE FOR APPROPRIATE OPERATION OF ELECTRONIC EQUIPMENT INSTALLED INSIDE A SHELTER FOR TELECOMMUNICATION APPLICATIONS. SPECIAL ATTENTION IS DEFERRED TO THE SELECTION OF THERMOELECTRIC COOLERS AND TO THE DEFINITION OF MOUNTING POSITIONS OF THE COOLERS ON THE HEATSINKS. A STUDY WAS CONDUCTED TO ANALYZE THE THERMAL AND HYDRODYNAMIC CONDITIONS INSIDE THE CHAMBER. THIS STUDY WAS BASED ON COMPUTER SIMULATIONS CARRIED OUT USING THE PROGRAM AUTOFLOW ¾ A COMPUTATIONAL FLUID MECHANICS TOOL. RESULTS OF THESE SIMULATIONS ARE SHOWN AND DISCUSSED.
KEY WORDS. THERMOELECTRIC COOLERS, ELECTRONIC DEVICES COOLING, TELECOMMUNICATION CABINETS.
|
| |
|
Author :
|
Velásquez, José Antonio
|
| |
|
Paper View :
|
|
