Eventos Anais de eventos
MECSOL 2019
7th International Symposium on Solid Mechanics
Evaluation of Effective Electromechanical Coupling Coefficient of Piezoelectric Structures Considering Viscoelastic Properties of Adhesive Layer
Submission Author:
Jelder Quinones Velasquez , SP
Co-Authors:
Jelder Quinones Velasquez, Marcelo A. Trindade
Presenter: Jelder Quinones Velasquez
doi://10.26678/ABCM.MECSOL2019.MSL19-0182
Abstract
This work intends to investigate the influences of the viscoelastic behavior of adhesive layer between host structure and surface-bonded piezoelectric patches on the performance of a smart multifunctional plate structure. A finite element model, developed for fully taking into account important properties of the adhesive layer combined with modal strain energy approach to derivate an approximate expression for modal loss factor are used to perform a comparative analysis of the estimated modal effective electromechanical coupling coefficient of the structure.
Keywords
Piezoelectric materials, Finite Element Method, viscoelasticity, Smart Structures
