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DINAME2019
DINAME2019
Effect of piezoelectric patches segmentation and adhesive layer properties on the electromechanical coupling of smart structures
Submission Author:
Jelder Quinones Velasquez , SP
Co-Authors:
Jelder Quinones Velasquez, Marcelo A. Trindade
Presenter: Jelder Quinones Velasquez
doi://10.26678/ABCM.DINAME2019.DIN2019-0105
Abstract
Adhesive layer between surface-bonded piezoelectric patches and a host structure is responsible for transferring the mechanical stress and strain field; as a consequence, the performance of smart piezoelectric structures can be strongly influenced by the adhesive layer properties. However, such effect has not been extensively studied despite some works indicating a potential reduction in the transmissibility. Therefore, some aspects affecting the electromechanical coupling, such as the segmentation of the piezoelectric patches and bonding effectiveness are investigated in this work by means of parametric analyses of the adhesive layer properties (thickness, thickness uniformity and Young’s modulus). This is done for a thin plate with surface bonded piezoelectric patches and results are obtained using a custom finite element model that accounts for adhesive layer properties
Keywords
Piezoelectric materials, energy harvesting, Finite Element Method, Smart Structures, Adhesive layer
