Eventos Anais de eventos
CONEM 2018
X Congresso Nacional de Engenharia Mecânica
Finite Element Analysis applied on the Cooling of Electronic Components
Submission Author:
Luís Henrique Carnevale , RJ
Co-Authors:
Luís Henrique Carnevale , Gustavo Rabello dos Anjos, Norberto Mangiavacchi
Presenter: Luís Henrique Carnevale
doi://10.26678/ABCM.CONEM2018.CON18-1208
Abstract
The numerical simulation is an important tool to solve problems found in several physical processes, such as oil drilling, reservoir filling, hemodynamic and cooling of electronic components, the latter of great importance for describing problems related to controlling flow and temperature conditions for new generation of stack processors. It is in this scope that this project retains, for the development and improvement of a study platform using finite elements method simulation in order to study, in details, physical processes involved in cooling the electronic components, specifically the characterization of temperature distribution in flows with different geometry. With this project, the objective is to comprehend, in detail, the mechanisms of heat dissipation in modern electronic components. Furthermore, it is also desired to have a better understanding of which alternatives present the most efficient cooling.
Keywords
Finite Element Method, Complex Geometries, Cooling of Electronic Components
