Eventos Anais de eventos
COBEM 2021
26th International Congress of Mechanical Engineering
THERMAL PERFORMANCE ANALYSIS OF AN ULTRA-THIN LOOP HEAT PIPE FOR ELECTRONIC COOLING APPLICATION
Submission Author:
Kelvin Guessi Domiciano , SC
Co-Authors:
Kelvin Guessi Domiciano, Larissa Krambeck, JUAN PABLO FLOREZ, Marcia Mantelli
Presenter: Kelvin Guessi Domiciano
doi://10.26678/ABCM.COBEM2021.COB2021-1228
Abstract
A flat ultra-thin loop heat pipe (UTLHP) is experimentally developed and investigated in the present study. Sintering and diffusion bonding technology are used to manufacture the device with a thin thickness. The ultra-thin loop heat pipe consists of 76 mm x 60 mm composed of three flat copper sheets, totalizing the thickness of 1.6 mm. The device presents a primary wick structure located at the evaporator and a secondary wick structure located at the liquid line to promote the working fluid return to the heated side. Both porous media consists of sintered copper powder. Water is used as the working fluid. A workbench is developed to simulate the operating condition and the geometric characteristics of a chip mobile electronic processor with 1 cm², a typical application, to evaluate the ultra-thin loop heat pipe thermal performance at the horizontal position. The condenser is cooled by natural air convection. The experimental analysis showed that the UTLHP operates effectively, starting to work at low heat flux (3 W/cm²) with an evaporator temperature of 56.2 ºC. The device revealed a minimum thermal resistance of 1.05 °C/W at 8 W/cm². The experimental results proved that the device is suitable for electronic cooling applications of miniature devices, working with an evaporator temperature below 100 ºC.
Keywords
ultra-thin loop heat pipe, diffusion bonding of UTLHPs, electronic application
