Eventos Anais de eventos
COBEM 2019
25th International Congress of Mechanical Engineering
STUDY OF HEAT FLOW THROUGH MULTIPLE FORMS OF WAFER BAKING PLATES
Submission Author:
Marcelo Risso Errera , PR
Co-Authors:
Marcio Carzino, Marcelo Risso Errera, George Stanescu
Presenter: Marcio Carzino
doi://10.26678/ABCM.COBEM2019.COB2019-2234
Abstract
There is a large worldwide demand to develop wafer baking equipments. The main goals are to increase production with quality and to reduce wastes and energy consumption. This work deals with thermal design in the heating side of baking plates of wafer gas ovens. The thermal interaction between the gas flames and the baking plates is considered. The flames are modelled as a radiant solid surface with fixed geometry and high-temperature. Heat flows mostly by thermal radiation to the back of the baking plates which design is under study. Steady, 2-d, heat conduction within the baking plate determines the superficial temperature of the baking side. All the physics is modelled mathematically and solved in a commercial finite-element software. The method of Constructal Design is employed in order to study designs of the back surface of the baking plates, for instance, the possibility of extended surfaces for a given volume of material. Variable rectangular, trapezoidal and parabolic fins were considered. They varied in number and geometry accordingly. Results showed the baking plate with 17 fins provides a better heat distribution and increase of near 20 oC from the plate with 3 fins. This means an overall gain of approximately 10%. In sum the new designs provide better heat transfer that in turn decreases the baking time, and it also improves heat distribution thus warranting product quality. Furthermore, the new designs provide the same mechanical resistance with less 17% material.
Keywords
food ovens, Radiation heat transfer, heat conduction, thermal radiation, Constructal Design
