Eventos Anais de eventos
COBEM 2019
25th International Congress of Mechanical Engineering
INFLUENCE OF DIAMOND WIRE SAWING PARAMETERS ON SUBSURFACE MICROCRACKS FORMATION IN MONOCRYSTALLINE SILICON WAFER
Submission Author:
Erick Cardoso Costa , SC
Co-Authors:
Erick Cardoso Costa, Caroline Piesanti dos Santos, Fabio Antonio Xavier, Walter Lindolfo Weingaertner
Presenter: Erick Cardoso Costa
doi://10.26678/ABCM.COBEM2019.COB2019-1574
Abstract
Multi-wire sawing is one of the machining processes for silicon wafer manufacturing. Although this process to be stable along the production chain, the knowledge about wafering process is still empirical, based mainly on operators’ experience, trial and error. This is mainly due to machine-tool design complexity, material removal kinematic and silicon brittle behavior. Hence, the process still requires experimental investigations towards sawing process peculiarities. In this sense, the present paper aims to analyze cutting speed and feed speed influence on subsurface microcrack formation and surface roughness parameter Rz of monocrystalline silicon cut by endless diamond wire. Results showed that feed speed increase caused higher microcrack nucleation and propagation due to higher kinematic cutting edge penetration. On the other hand, increase of cutting speed promoted higher cutting edge engagement frequency, which decreased cutting edge penetration and led to smaller microcrack depth damage. In the same way, surface roughness parameter Rz was higher when feed speed enlarged and lower with wire cutting speed was larger. Both microcrack depth and surface roughness parameter Rz showed an upward linear correlation.
Keywords
endless diamond wire saw, monocrystalline silicon, subsurface microcrack damage, continuous sawing
