Eventos Anais de eventos
COBEM 2019
25th International Congress of Mechanical Engineering
APPLICATION OF TOPOLOGY OPTIMIZATION TO THE MICROCHANNEL COOLING OF MICROPROCESSORS HOT-SPOTS
Submission Author:
Rodrigo Vidonscky , SP
Co-Authors:
Rodrigo Vidonscky, Flavio Augusto Sanzovo Fiorelli
Presenter: Rodrigo Vidonscky
doi://10.26678/ABCM.COBEM2019.COB2019-1148
Abstract
Studies using topology optimization for the construction of a microchannel heat sink geometry coupled to a microprocessor currently present several solutions regarding an optimal pressure drop along this heat sink, an optimal heat dissipation from the microprocessor, or a trade-off relation between those two solutions. However, the physical model and the simplifications adopted in these studies, such as the neglect of the convective term of the Navier-Stokes equations and the adoption of velocity profiles as outlet boundary conditions, are not consistent with the physical problem. Also, there are a number of recent studies that seek to obtain a heat dissipation solution for microprocessors using the least amount of energy, removing the heat produced only in the hot-spot regions. So, the present study comprises the elaboration of an improved topology optimization process for the obtainment of a microchannel heat sink geometry regarding the correction of this physical model and these simplifications, as well as the maximum heat dissipation of only the hot-spot regions. The solution of this topology optimization process resulted in geometries clearly exposing the influence of each of these applied corrections, such as different shape transitions, asymmetrical behavior, the suppression of an outlet region and a geometry presenting a trade-off relation between minimal pressure drop and heat dissipation only in the hot spot regions.
Keywords
microprocessor, Hot spot, Topology optimization
