Eventos Anais de eventos
COBEM 2019
25th International Congress of Mechanical Engineering
Numerical Analysis Of The Size Ratio Of Integrated Circuit And Heatsink With And Without Vapor Chamber
Submission Author:
Reginaldo Ribeiro Sousa , MS
Co-Authors:
Reginaldo Ribeiro Sousa, Tatiane Sousa
Presenter: Reginaldo Ribeiro Sousa
doi://10.26678/ABCM.COBEM2019.COB2019-0133
Abstract
This article has as the main objective of this work is to verify how the size ratio between the integrated circuit and heatsink assembly influences the IC heat dissipation process, and if the use of vapor chamber alters this size ratio. This study was performed to two different types of sets of heat dissipation can work in a forced convection environment. The first set, which was called Model 1, is composed of a printed circuit board, integrate circuit and a heatsink. The second set (Model 2) is composed of a printed circuit board, integrate circuit, heatsink and a vapor chamber. For the accomplishment of this work, a simple thermal resistors model was constructed using ANSYS Fluent software, student license, as computational fluid dynamics tool, represented by blocks with fixed thermal properties, modifying only the dimensions. The results show the temperature behavior of the heatsink and the integrated circuit for each model. The results prove that using vapor chamber reduces the temperature of the integrated circuit by up to 14%. This occurs when the heatsink is 60 times larger than the IC. It was also observed that when using vapor chamber, a heatsink up to 60 times larger than the IC can be used, because up to this size ratio, there is a reduction in the IC’s temperature. In the model without vapor chamber this process occurs when the heatsink is only 30 times larger than the IC.
Keywords
Vapor Chamber, Numerical analysis, Heatsink, Electronic components, Cooling of electronic systems
