Eventos Anais de eventos
COBEM 2017
24th ABCM International Congress of Mechanical Engineering
Stress analysis of a diffusion bonding device under loading and thermal expansion.
Submission Author:
Gabriel Serafin Couto Vieira , SC
Co-Authors:
Gabriel Serafin Couto Vieira, Gustavo George Verdieri Nuernberg, Nelson Yurako Londono Pabon, Marcia Mantelli
Presenter: Gabriel Serafin Couto Vieira
doi://10.26678/ABCM.COBEM2017.COB17-5949
Abstract
The process of diffusion bonding occurs when two solid mating surfaces join through the atomic diffusion of their solid bodies. While temperature, pressure and time are the fundamental diffusion bonding process parameters, its effectiveness also depends on the geometrical properties of the bodies. In order to provide appropriate pressure distribution to these mating surfaces, a device was proposed. It consists of two stainless steel boards with passing holes near its edges and carbon steel screws to provide the needed pressure. The samples to be bounded consist of slabs of aluminum and are sandwiched between the boards. Screws hold the whole system tightly together while the set is subjected to high temperatures. It is noted that the aluminum’s coefficient of thermal expansion is significantly larger than that of the stainless and carbon steels. Therefore, when subjected to temperature variations, the previously calculated pressure does not stand and, therefore, the temperature effects on the thermal expansions and on the Young’s module, must be considered in the determination of the applied pressure. Moreover, previous experience shows that the indiscriminate use of pressure may irreparably damage the pressure application device during the bounding process. The purpose of this work is to provide a solid mechanic study of the stress distribution observed in the pressure device, while it is subjected to high temperatures and loads, during the diffusion bonding process. Special attention is given to the estimative of the real pressure while heating takes place.
Keywords
Diffusion bonding, Stress Analysis, thermal expansion
