Eventos Anais de eventos
COBEM 2017
24th ABCM International Congress of Mechanical Engineering
MODELING AND SIMULATION OF THERMAL MANAGEMENT SYSTEMS OF ELECTRONIC EQUIPMENT
Submission Author:
Luiz Rigatti , Casado(a)
Co-Authors:
Luiz Rigatti, JOSÉ VIRIATO COELHO VARGAS, Wellington Balmant
Presenter: Luiz Rigatti
doi://10.26678/ABCM.COBEM2017.COB17-1931
Abstract
Electronic devices are usually protected by cabinets, for electrostatic and weather protection of the environment in which they are located, however, such electronic equipment can dissipate a great amount of heat due to the Joule effect, which is an aggravating factor for the useful life and efficient equipment. Thus, there is a need for a heat dissipation system. One of the ways to improve the thermal efficiency of this system is mathematical modeling and computer simulation, which can be tools used to analyze this problem even in the design phases. Therefore, the objective of this work is the mathematical modeling and the simulation of a metal cabinet that holds electronic equipment. The mathematical model consists of the transient energy balance of the system using the first law of thermodynamics. The system was discretized using the Volume Element Method (VEM), which generates a mesh with a system of first order ordinary differential equations, where the independent variable is time. The simulations of the model described the expected results in practice. The objective is to aggregate information to transform this methodology as a tool for simulation and optimization of the thermal profile of electronic packaging systems.
Keywords
Volume Element Method (VEM)., Mathematical Modeling., Simulation. Optimization., Telecom Enclosure.
