Eventos Anais de eventos
ENCIT 2022
19th Brazilian Congress of Thermal Sciences and Engineering
NUMERICAL COMPARISON ON THERMAL PERFORMANCE OF DIFFERENT CROSS SECTIONS OF PIN-FIN HEAT SINKS
Submission Author:
Rafael San Martin Moreira , RJ
Co-Authors:
Rafael San Martin Moreira, Elena Peñaranda, Diego Busson de Moraes, Carolina Palma Naveira Cotta, Paulo Roberto Siqueira da Costa Júnior, Joao Alves de Lima
Presenter: Rafael San Martin Moreira
doi://10.26678/ABCM.ENCIT2022.CIT22-0470
Abstract
Recently, due to the grown development of micro devices in different fields of applications such as electronics, solar, bio engineering, etc., the needing of more efficient of heating removal sink has become an essential concern in this field of science. In this sense, pin fin configuration has been shown high cooling capacity and assists in uniform temperature distribution with a low pressure drop. In this context, this work aims to analyze four different pin-fin geometries (diamond, drop, sinusoidal, and circular), in the staggered configuration, in the search for the best thermohydraulic performance in microscale heat exchangers, which will be attached to solar cells installed in a high-concentration photovoltaic system (HCPV). The geometries were obtained through DLMM (direct laser metal melting) additive manufacturing process, satisfying the required dimensional quality. It was constated that the construction of channels with pin fins proved to be more effective in terms of heat exchange when compared to straight microchannels with rectangular cross section results, without compromising to much the pumping power needed for the fluid flow. Additionally, it was also be observed that the sine, drop and diamond shapes presented results with higher fluid outlet temperature and a smaller pressure drop results than the microchannel. Among these three pin-fin geometric models, the droplet model produced the highest heat exchanges, resulting in the highest enthalpic gain by the fluid at the HCPV exchanger outlet.
Keywords
pin fin, Numerical simulation, micro heat sink, Thermal performance
