Eventos Anais de eventos
ENCIT 2022
19th Brazilian Congress of Thermal Sciences and Engineering
MODELING AND SIMULATION APPLIED TO THE THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS
Submission Author:
Luiz Rigatti , Casado(a)
Co-Authors:
Luiz Rigatti, JOSÉ VIRIATO COELHO VARGAS, Wellington Balmant, André Bellin Mariano
Presenter: Luiz Rigatti
doi://10.26678/ABCM.ENCIT2022.CIT22-0373
Abstract
Telecommunications cabinets, computer cabinets and server bases in general operate indoors, guaranteeing the security of the system. However, electronic equipment located inside the cabinets dissipate heat during an operation, so it is necessary to use heat dissipation systems in the cabinet, ensuring acceptable operating temperatures and standardization. If the temperature is not controlled, the efficiency and useful life of the equipment will be compromised. One way to approach this problem is mathematical modeling and computer simulation, this methodology allows analysis during all phases of the project. Therefore, this study experimentally investigates the ability of a simplified computer simulation methodology to evaluate the thermal response of electronic packaging cabinets. Quick and accurate responses in the first stage system design are crucial for decision making, and a tool with quick responses is important. The modeling depicts a volume element model (VEM), which allows for different phases within the solution domain (eg solid and gas). The physical laws of conservation, empirical and theoretical correlations available, are the basis of the model. In this way, only a set of algebraic and time-dependent ordinary differential equations is needed to obtain the spatial variable of the process (eg temperature), spatial distribution and transient response. Laboratory experiments were carried out to measure the thermal response of a cabinet (2048×1974×850 mm) containing a single heat source. A first set of experimental data with a power source of 1600 W was used to fit the model by solving the inverse parameter estimation problem (IPPE), in which the selected fit parameters were the average air velocities inside the cabinet. . Then, a second experimental set with a power source of 3000 W was also used to validate the model results. In the simulations, the converged mesh is expected to have a low number of volume elements. After validation, the model can be used to study the effect of varying the height of the heat source on the thermal response of the system. Fundamentally, it seeks to identify the critical temperatures and thus find ideal positions for the heat source, which is worth pursuing, regardless of the complexity of the actual cabinet design. The other important conclusion is that the accuracy and low computational time will ensure the reliability of the model for the design and optimization of the electronic packaging cabinet.
Keywords
Thermal Control, Volume Elements Method (MEV), Simulation, Telecommunications Offices
