Eventos Anais de eventos
ENCIT 2022
19th Brazilian Congress of Thermal Sciences and Engineering
THERMAL PERFORMANCE OF MINI LOOP HEAT PIPE: INFLUENCE OF COOLING SYSTEMS
Submission Author:
Kelvin Guessi Domiciano , SC
Co-Authors:
Kelvin Guessi Domiciano, Larissa Krambeck, JUAN PABLO FLOREZ, Marcia Mantelli
Presenter: Kelvin Guessi Domiciano
doi://10.26678/ABCM.ENCIT2022.CIT22-0123
Abstract
Loop Heat Pipe (LHP) is a closed device containing a working fluid that transfers heat through the phase-change phenomenon from a hot to a cold region. According to the application, the heat transfer device must attend to some requirements, such as geometry, weight, heat transfer capacity and the available cooling system. In this regard, a flat LHP of 76 x 60 x 1.6 mm was developed for the thermal management of electronic gadgets. Sintering of copper powder and diffusion bonding was used to manufacture the device. Ethanol was used as the working fluid. An experimental bench to simulate the operating condition and the geometric characteristics of electronics were developed. The LHP was tested in the horizontal orientation (without gravity assistance) and gravity-assisted position. Two cooling systems were used: natural air convection and forced water convection. The main objective of this paper is to evaluate the effect of the cooling system on the thermal performance of the LHP. The LHP started working with 2 W/cm2 for all conditions and reached a maximum heat flux of 16 W/cm2. However, in forced water convection, the device could not operate successfully as an LHP once the vapor didn't achieve the entire condenser.
Keywords
Loop heat pipe, Diffusion bonding, Thermal performance, electronics application, cooling systems
