Eventos Anais de eventos
ENCIT 2016
16th Brazilian Congress of Thermal Sciences and Engineering
THEORETICAL AND EXPERIMENTAL ANALYSES OF 3D CONJUGATED HEAT TRASNFER PROBLEM IN A IGBT POWER MODULE
Submission Author:
Carolina Palma Naveira Cotta , RJ
Co-Authors:
Philippe Rollemberg d'Egmont, Christopher Tostado, Fernando Pereira Duda, Antônio da Cruz, Kelvin Chen
Presenter: Philippe Rollemberg d'Egmont
doi://10.26678/ABCM.ENCIT2016.CIT2016-0467
Abstract
Applications of high-power semi-conductor modules of IGBT (Insulated Gate Bipolar Transistor) type include railway traction, motor drives and hybrid-electric vehicles. IGBT power modules generate a considerable amount of heat from the dissipation of electric power, which is an important reliability issue to be considered since the temperature of a semiconductor device must be kept within strict limits to avoid damage. Clearly, accurate models and simulation tools are required to compute the local temperature of the devices under different load conditions of the converter. This paper describes a transient 3-D conjugated heat transfer numerical solution, which is based on the Finite Element Method, for an IGBT power device with many layers of varying cross-sectional areas, different materials and multiple heat sources. The numerical results are validated against experimental results obtained via infrared thermography, which in turn can provide a large amount of non-intrusive temperature data of the entire external surface of the IGBT modules. A good agreement regarding numerical and experimental results was observed.
Keywords
3D numerical simulation, Infra Red measurements, Finite Element Method, Conjugated heat transfer, 3D numerical simulation, Infra Red measurements, Finite Element Method, Conjugated heat transfer, 3D numerical simulation, Infra Red measurements, Finite Element Method, Conjugated heat transfer, 3D numerical simulation, Infra Red measurements, Finite Element Method, Conjugated heat transfer
