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ENCIT 2020
18th Brazilian Congress of Thermal Sciences and Engineering
GEOMETRIC DESIGN FOR THERMAL AND DEFORMATION PERFORMANCE OF INDUSTRIAL WAFER BAKING PLATES
Submission Author:
Marcio Carzino , PR
Co-Authors:
Marcio Carzino, Marcelo Risso Errera, George Stanescu
Presenter: Marcio Carzino
doi://10.26678/ABCM.ENCIT2020.CIT20-0660
Abstract
Abstract. Wafer baking ovens are widely used in the world. They are produced in large scale and are under continuous development, particularly with the goal to reduce waste and energy consumption by all stakeholders while meeting the demand to increase productivity and product final quality. This paper addresses the thermal design of the baking plates of wafer gas ovens under operating and deformation constraints. We consider the effect of gas flames thermal interaction with the baking plates. The gas burners flames are simulated as a set of radiant solid strips with fixed geometry and imposed heat flux. The thermal radiation is the heat transfer mechanism prevailing from burners to the finned back of the baking plates from which steady state, three-dimensional, heat conduction takes place to the baking surface at the opposite side. A commercial finite-element software is used for computing the mathematical modeling and the physics interactions. Different designs for plates are evaluate by the Constructal Design method in order to seek better thermal solution for baking surface of the plates. The possibility of different geometric fins is considered for finite and fixed volume and assessed in this new study. We tested rectangular, trapezoidal, parabolic, triangular, pyramidal, cuneiform fins and with different numbers as well. Initial results showed the baking plate with large numbers long fins provides a better heat transfer and more uniform heat distribution on the baking surface when compared to the three-long-fins plate. The overall gain is approximately 10%. In general, a better heat transfer bakes the product with better coloring and uniform humidity, which in turn provides a good final quality of the product. The mechanical resistance is also evaluated, resulting around less 17% material a providing the same strength
Keywords
baking plate, wafer oven, Constructal Design, Radiation heat transfer, heat conduction
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