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ENCIT 2020
18th Brazilian Congress of Thermal Sciences and Engineering
A LUMPED-PARAMETER MODEL FOR THE THERMAL SIMULATION OF PRINTED CIRCUIT BOARDS
Submission Author:
Aron Martins Ferreira Milagres , MG
Co-Authors:
Aron Martins Ferreira Milagres, Victor H. P. Rosa, Cesar Deschamps
Presenter: Aron Martins Ferreira Milagres
doi://10.26678/ABCM.ENCIT2020.CIT20-0271
Abstract
The increasing miniaturization of electronic devices make the thermal management a necessary step in their design. The distributed-parameter simulation models are very useful in the analysis of many engineering applications. However, their computational cost is quite high for optimization routines and hence lumped-parameter models are extensively employed to assess thermal management alternatives of electronic devices. This paper presents a lumped-parameter model developed for thermal simulation of printed circuit boards. This model is applied to simulate different configurations of heat-generating components on the board and its predictions were found in satisfactory agreement with those of a distributed-parameter model with a fraction of the computational processing time.
Keywords
Printed Circuit Board, Thermal management, Natural Convection, thermal network
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