Eventos Anais de eventos
ENCIT 2020
18th Brazilian Congress of Thermal Sciences and Engineering
Assessment of Natural Convection Correlations for Thermal Simulation of Printed Circuit Boards
Submission Author:
Eduardo Camilo Marques de Andrade , SC
Co-Authors:
Eduardo Camilo Marques de Andrade, Victor H. P. Rosa, Cesar Deschamps
Presenter: Eduardo Camilo Marques de Andrade
doi://10.26678/ABCM.ENCIT2020.CIT20-0234
Abstract
The thermal management is an important step in the design of printed circuit boards (PCB) used in electronic devices due to failures caused by high operating temperatures. The thermal simulation of these boards using reduced-order models that require heat transfer correlations is an effective way to analyze thermal management alternatives. Most natural convection correlations for flat plates available in the literature were developed for isothermal or uniform heat flux conditions, but these conditions are not met in practice because PCBs have localized heat sources. The objective of this paper is twofold: (i) the assessment of heat transfer correlations to predict the temperature of PCBs; (ii) the development of correlations for some situations that are not covered by correlations available in the literature. The natural convection on a PCB with a heat dissipative chip placed on its center was numerically solved for vertical and inclined single plate, horizontal single plate facing upwards and downwards, and vertical and inclined channels. Predictions of average Nusselt number are presented for a range of Rayleigh numbers and compared with results obtained by using correlations available in the literature for similar geometries. We found that these correlations are suitable for most of the configurations, except for the case of a PCB exchanging heat on both surfaces, for which a new correlation is proposed herein.
Keywords
Natural Convection, Convection heat transfer correlation, Printed Circuit Board
