Eventos Anais de eventos
ENCIT 2018
Brazilian Congress of Thermal Sciences and Engineering
A REVIEW ON POLYMER HEAT SINKS FOR ELECTRONIC COOLING APPLICATIONS
Submission Author:
Daniel Borba Marchetto , SP , Brazil
Co-Authors:
Daniel Borba Marchetto, Debora Carneiro Moreira, Gherhardt Ribatski
Presenter: Daniel Borba Marchetto
doi://10.26678/ABCM.ENCIT2018.CIT18-0394
Abstract
The substitution of metallic materials by polymers in heat transfer applications allows reduction of weight and cost of components and is also a chemically and fouling resistant alternative. Although polymers are already used in heat exchangers, their low thermal conductivity is still considered the main limitation for electronics cooling applications. Recent advances in manufacturing polymeric matrix composites together with modern processing techniques have made it possible to overcome the problem of reduced conductivity through the addition of highly conductive reinforcements and the fabrication of thin walls, reducing the overall thermal resistance of heat sinks fabricated with these materials. In this review, some desirable characteristics of polymers are highlighted, as well as the current state of the art of polymer matrix composites. Numerical and experimental works related to polymeric and composite heat sinks for electronics cooling applications are presented, reporting their achieved thermal performance and the advantages and limitations in relation to metallic materials. A shortage of experimental works related to polymeric microchannel-based heat sinks is identified, which is an interesting topic to be explored in future investigations.
Keywords
heat sink, polymer, Composite, plastic, Microchannel
