Eventos Anais de eventos
ENCIT 2018
Brazilian Congress of Thermal Sciences and Engineering
MODELING AND SIMULATION OF THERMAL MANAGEMENT SYSTEMS OF ELECTRONIC EQUIPMENT
Submission Author:
Luiz Rigatti , Casado(a)
Co-Authors:
Luiz Rigatti, JOSÉ VIRIATO COELHO VARGAS, Wellington Balmant, Matias Nicolas Muñoz, Iago Gomes Costa, Leonardo Cavalheiro Martinez
Presenter: Matias Nicolas Muñoz
doi://10.26678/ABCM.ENCIT2018.CIT18-0224
Abstract
Electronic devices are usually protected by cabinets, for electrostatic and climatic protection of the environment in which they are located, however such electronic equipment can dissipate a great amount of heat due to the Joule effect, which is an aggravating factor for the life and efficiency the equipment. Thus, there is a need for a heat dissipation system. One of the ways to improve the thermal efficiency of this system is mathematical modeling and computer simulation. Therefore, the objective of this work is the mathematical modeling and the simulation of a metal cabinet containing electronic equipment. The mathematical model consists of the transient energy balance of the system using the first law of thermodynamics. The system was discretized using the Volume Element Method (VEM). The objective was to obtain a tool for simulating the thermal profile of electronic packaging systems.
Keywords
mathematical modeling, Simulation, Volume Element Method (VEM), Telecommunication Cabinets
