Eventos Anais de eventos
ENCIT 2018
Brazilian Congress of Thermal Sciences and Engineering
NUMERICAL ANALYSIS OF DEFECTS USING INFRARED THERMOGRAFY VARYING ITS DEPTH
Submission Author:
Thiago Semann , PR
Co-Authors:
Thiago Semann, Luís Mauro Moura, Stephan Hennings Och
Presenter: Thiago Semann
doi://10.26678/ABCM.ENCIT2018.CIT18-0095
Abstract
The present work is based on the analysis of the variation of the surface temperature, varying the depth of the defect in the sample. With the analysis of this sensibility, it is possible to identify the impact that this variation of depth will cause for the identification of defects in the sample. Considering that only one plan of the material will be used to make this study.
Keywords
mvf, Thermography, Infrared Camera, Sensitivity
