Eventos Anais de eventos
ENCIT 2018
Brazilian Congress of Thermal Sciences and Engineering
NUMERICAL ANALYSIS OF COOLING OF ELECTRONIC COMPONENTS BY HEATSINKS WITH MICROCHANNELS
Submission Author:
Felipe Guahyba dos Reis , RS
Co-Authors:
Felipe Guahyba dos Reis, Francis França, Leonardo Brito Kothe
Presenter: Francis França
doi://10.26678/ABCM.ENCIT2018.CIT18-0063
Abstract
This paper presents a numerical study on the performance of heatsinks with microchannels. For the validation of the numerical tool, a comparison with a known experimental study is carried out, and then improvements available in the literature on the subject are tested and compared. The numerical simulations are performed with the Fluent® software using the Finite Volumes Method (FVM). The mesh quality is evaluated through the GCI (Grid Convergence Index) method. The numerical result of the thermal resistance of the heatsink from the experimental study on which the first part of this paper is based was 0.097 °C/W, whereas the experimental result was 0.090 °C/W (with a maximum temperature of 373 K), representing a difference of 7.2%. An improvement is performed by integrating the heatsink to a HVAC (heating, ventilation and air conditioning) system, which lowers the inlet temperature and consequently lowers the highest temperature found in the system (350 K for the same dissipated power) without changing the thermal resistance, but providing gains in reliability. Changes in the heatsink geometry are presented by decreasing the inlet area, causing the resistance to vary from 0.097 °C/W for the original channel to 0.272 °C/W for the channel that has the lowest height. A heatsink whose microchannels have waves in their longitudinal dimensions is shown, but the expected effects of better mixing and greater contact area for the heat flux were not observed for the boundary conditions of the original experiment, the calculated thermal resistance was of 0.102 °C/W. The last analysis presents an idealization where the heat flux is evenly distributed in the silicon volume, with a thermal resistance of 0.084 °C/W.
Keywords
Heatsinks, Heat Exchangers, microchannels, Numerical Study, Thermal Resistance
