S7  Empacotamento Eletrônico    Titulo: 3D MODEL TO ANALYSE THE THERMAL BEHAVIOR OF A DIGITAL RECTIFIER   Resumo : THE CONTINUING SUBSTITUTION OF ANALOG BY DIGITAL MODULES IN MEDIUM AND LARGE SIZE TELECOMMUNICATION SYSTEMS, HAVE BEEN CONTRIBUTING TO HIGHLIGHT THE IMPORTANCE OF STUDYING THE THERMAL BEHAVIOR IN THESE EQUIPMENTS. IT IS WELL ACKNOWLEDGED THAT LARGE AMOUNTS OF ENERGY IS DISSIPATED IN SMALL AREAS (ELECTRONIC COMPONENTS), IN SUCH A CLASS OF SYSTEM. ONE CAN OBSERVE CONVECTION TRANSPORT DRIVEN BY DENSITY GRADIENTS AND/OR BY FORCED VENTILATION. THE AIM OF THIS STUDY IS TO INVESTIGATE THE THERMAL BEHAVIOR OF A DIGITAL RECTIFIER LOCATED INSIDE A TELECOM CABINET. A 3D NUMERICAL MODEL, BASED ON COMPUTATIONAL FLUID DYNAMICS, WAS CONSTRUCTED TO REPRESENT THE WHOLE PACKAGE. FOR SIMPLICITY ONLY COMPONENTS THAT HAVE THE MOST REPRESENTATIVE SIZE AND POWER DISSIPATION WERE CONSIDERED. RESULTS CONCERNING DIFFERENT RECTIFIER CONFIGURATIONS (SUCH AS COMPONENTS ARRANGEMENT AND VENTILATION ENTRANCE/EXHAUST) ARE PRESENTED IN ORDER TO IDENTIFY DEFICIENT VENTILATION AND HIGH TEMPERATURE REGIONS. KEYWORDS: ELECTRONICS PACKAGING, COOLING ELECTRONICS, THERMAL ANALISYS.    Autores : Junqueira, Silvio L. M. Naaktgeboren, Christian 0     Trabalho Completo :   COBEM99 | Comissão  Organizadora | Palestras | Sessões Técnicas | Autor | Simpósios e Sessões Especiais | Revisores |  Título  dos  Trabalhos | Local