| |
|
S7 Empacotamento Eletrônico |
| |
|
Titulo:
|
TRIDIMENSIONAL ANALYSIS OF TELECOMMUNICATION CABINETS: THERMAL SIMULATION
|
| |
|
Resumo :
|
|
IN THIS WORK IS PRESENTED A TRIDIMENSIONAL THERMAL SIMULATION OF A LARGE TELECOM
CABINET. THE NUMERICAL SIMULATION PERMITS TO FORESEE FUTURE FAILURES IN THE EQUIPMENT WHILE
OPERATING, DUE TO THE HIGH TEMPERATURES REGIONS THAT MAY OCCUR FOR THE REASON OF THE THERMAL
POWER DISSIPATED FROM ITS COMPONENTS. FOR THE AIR FLOW SOLUTION IN THE CABINET WAS USED THE
SOFTWARE FLOTHERM ® AND A MESH WITH MORE THAN 1.000.000 OF CONTROL VOLUMES. THE
COMPARISON BETWEEN THE NUMERICAL AND EXPERIMENTAL RESULTS ARE VERY GOOD.
KEY-WORDS: ELECTRONIC PACKING, THERMAL SIMULATION, TELECOM CABINET, FINITE VOLUME. |
| |
|
Autores :
|
Franco, Admilson Teixeira
Luersen, Marco Antonio 0
Naaktgeboren, Christian 0
|
| |
|
Trabalho Completo :
|
|
