S7  Empacotamento Eletrônico    Titulo: SMT: MATERIALS, FABRICATION PROCESSES AND FATIGUE STRENGTH OF SOLDERS   Resumo : THE ELECTRONIC PACKAGING USING THE SURFACE MOUNTING TECHNOLOGY (SMT) IS VERY IMPORTANT BECAUSE IT MAKES POSSIBLE THE MINIATURIZATION OF CIRCUITS. NOWADAYS, THE ELECTRONIC PRODUCTION INDUSTRY IS LOOKING FOR THE BEST RELATIONSHIP AMONG SIZE, WEIGHT OF COMPONENTS AND THE PRINTED CIRCUIT BOARD, COST OF PRODUCTION (INCLUDING REWORK), QUALITY AND RELIABILITY OF PRODUCTS. THE EFFICIENCY OF THE COMPONENT SOLDERING PROCESSES ARE INFLUENCED BY THE INTERACTION AMONG MATERIALS, THE CORRECT PARAMETERS INVOLVED IN EACH STEP OF THE PROCESS OF COMPONENT SOLDERING, THE BEHAVIOR OF THE MATERIALS, AND THE SOLICITATION THAT THEY ARE SUBMITTED. THE ELECTRONIC PACKAGING AND THE CIRCUIT MOUNT HAVE BEEN DONE WITH SOLDER ALLOYS THAT REALIZE THE JUNCTION OF MATERIALS PRESERVING THE PROPERTIES OF THE ELECTRICAL, THERMAL AND MECHANICAL DESIGNS. THIS WORK PRESENTS A BIBLIOGRAPHIC REVISION ABOUT MATERIALS AND PROCESSES USED TO SOLDER SURFACE MOUNTING COMPONENTS (SMC) AND DESCRIBES THE FATIGUE STRENGTH IN RELATION TO TEMPERATURE AND FREQUENCIES IN WHICH THE JUNCTIONS ARE SUBMITTED. THE RESULTS OF EXPERIMENTS SHOW THAT THERE ARE VARIABLES THOSE INFLUENCE REFLUX PROCESS INCLUDING THE EQUIPMENT, THE CIRCUIT BOARD DESIGN, FLUXES USED AND PROCESS CONTROL. EXPERIMENTAL RESULTS SHOW THAT WITH THE INCREASE OF THE TEMPERATURE, THERE IS A DECREASE OF THE CYCLES NUMBER TO THE SOLDER CRACK AND WHEN THE FREQUENCY INCREASE THE CYCLE NUMBER TO FAIL INCREASE. THE PREVISIONS OF TIME LIFE ARE YET A GREAT CHALLENGE BECAUSE OF THE COMPLEX BEHAVIOR OF THE SOLDER JUNCTION UNDER SEVERAL WORK CONDITIONS SERVICES AND ABSENCE OF DATES.    Autores : Ferreira, Itamar 0 Grigoletto, Eliane Maria     Trabalho Completo :   COBEM99 | Comissão  Organizadora | Palestras | Sessões Técnicas | Autor | Simpósios e Sessões Especiais | Revisores |  Título  dos  Trabalhos | Local