variavel0=<b>VALERI V. VLASSOV</b> - vlassov@dem.inpe.br INPE
<b>Abstract.</b> The thermal model of an electronic circuit board with installed heat dissipating components is presented as a twodimension steady-state heat conduction problem with multiple sources distributed on a rectangular region. The corresponding energy equation includes a source term as well as a temperature-dependent term to account for linear heat transfer in z-direction. Boundary conditions are of first type with unique temperature along the perimeter. The integral-transform technique was applied to obtain closed-form integral solution. Assuming that all dissipated components have a rectangular contact area with the plate, multiple integrals for each dissipated sub-region are easily found. A temperature map over the plate is calculated from the closed expression with triple sums of series with respect to each coordinate and each source. The error was evaluated by the estimation of truncated terms values. A generalization of this solution is discussed. The solution was applied to find the temperature distribution over the electronic Driver Plate of the CEP block of the CIMEX Brazilian experiment planned to fly onboard a Space Shuttle mission as a Get Away Special payload.
<b>Keywords.</b> Temperature distribution, hot spot, Integral transform, Circuit board.