variavel0=<b>Ivan Azevedo Cardoso</b> - ivanac@rla01.pucpr.br Pontifícia Universidade Católica do Paraná
<b>Rogério Marcos Barbosa</b> - d0016009@rla14.pucpr.br Pontifícia Universidade Católica do Paraná
<b>Abstract.</b> Last years the industry of eletro-electronic equipments has appelled with great frequency to the use of new systems of resins with the specific purpose of serving as products of encapsulation of circuits, diodes and other components assets and liabilities. These new vehicles are in majority based in polymers that through their crosslinking are capable to accommodate substances with the initial purpose of protect them of the environmental agents. In spite of the efficiency factor that is related to the project of these devices to meet in quite advanced level the durability of the eletro-electronic devices is still a limit factor. The termoxidative degradation and the loss of componentes due evaporation, besides the penetration of sludges for diffusion in the printed and integrated circuits, can take frankly to a profile decreasing of the electric conductivity in function of the time and to short circuits. In our work it was studied an encapsulation system of high performance recently developed. The crosslinking process of these systems leads the formation of polymerics nets of high density, excellent adhesion, mechanical consistence and chemical resistance. We investigated the gelation kinetics of the system in function of the temperature and of the amounts of the crosslinking agents through advanced real time rheological methods, using the dynamic oscillatory rotational reometry.
<b>Keywords.</b> rheology, polymers, non-newtonian fluids.