Papers List : Electronic Packaging PARTICLE IMAGE VELOCIMETRY MEASUREMENTS AT THE ENTRANCE REGION OF A ONE-SIDED HEATED VERTICAL CHANNEL IN NATURAL CONVECTION NUMERICAL AND EXPERIMENTAL ANALYSIS OF THE NATURAL CONVECTION IN CAVITIES WITH PROTRUDING HEAT SOURCES AT THE BASE NATURAL CONVECTION IN A VERTICAL CAVITY WITH HEAT SOURCES SIMULATING ELECTRONIC COMPONENTS STUDY OF THE ASPECT RATIO EFFECT IN A THERMALLY-DRIVEN OPEN CAVITY THE INFLUENCE OF THE DISTANCE BETWEEN PLATES IN AN ARRAY OF VERTICAL PRINTED CIRCUIT BOARDS COOLED BY NATURAL CONVECTION: NUMERICAL AND EXPERIMENTAL ANALYSIS PRESSURE DROP AND HEAT TRANSFER IN AIRFLOW COOLED FINNED HEAT SINKS USING CORRELATIONS SMT: MATERIALS, FABRICATION PROCESSES AND FATIGUE STRENGTH OF SOLDERS TRIDIMENSIONAL ANALYSIS OF TELECOMMUNICATION CABINETS: THERMAL SIMULATION 3D MODEL TO ANALYSE THE THERMAL BEHAVIOR OF A DIGITAL RECTIFIER UTILIZATION OF THERMOELECTRIC DEVICES FOR COOLING ELECTRONIC EQUIPMENT INSTALLED IN CABINETS
Papers List : Electronic Packaging
COBEM99 | Organizing Committee | Keynotes | Technical Sessions | Author | Symposia and special sessions | Referees | Work Titles | Venue